Pdf: Ipc-9704

[SMT Assembly] ➔ [In-Circuit Testing (ICT)] ➔ [Board Routing/Dicing] ➔ [Final Enclosure Assembly] 1. In-Circuit Testing (ICT) and Functional Testing (FCT)

The IPC/JEDEC-9704 standard establishes methodologies for measuring mechanical strain on PCBs during assembly, test, and handling to prevent failures like solder joint fracture and pad cratering. It requires identifying high-risk processes, such as SMT and press-fit insertion, and placing strain gages within 5mm of critical components. For details on purchasing the standard, visit Nimonik Standards . IPC/JEDEC-9704 Strain Gage Guidelines | PDF - Scribd ipc-9704 pdf